Sputtering is one of the most common and widely used technologies for thin film manufacturing. Target materials are available in a variety of grades and purities to meet specific customer requirements.
|Grade||3N, 3N5, 4N, with Ta 99.99%min|
|Grain size||ASTM 4 or finer|
|Surface finish||16Rms max. or Ra 0.4 ( RMS64 or better)|
|Flatness||0.1mm or 0.15% max|
|Tolerance||+/-0.010" on all dimensions|