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» Tantalum Sputtering Targets

Tantalum Tantalium Sputtering Targets Sputering
Sputtering is one of the most common and widely used technologies for thin film manufacturing. Target materials are available in a variety of grades and purities to meet specific customer requirements.

Grade 3N, 3N5, 4N, with Ta 99.99%min
Recrystallization  95%min
Grain size ASTM 4 or finer
Surface finish 16Rms max. or Ra 0.4 ( RMS64 or better)
Flatness  0.1mm or 0.15% max
Tolerance    +/-0.010" on all dimensions
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